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Shop size relief for thin heat sinks that run hot.
UPSIREN U6 PRO 50g is a workshop oriented size of our high performance thermal putty for compact cooling hardware. It establishes a conformable heat path between components and thin heat sinks used in gaming laptops and space constrained devices, improving contact where conventional pads leave gaps. With 12.8 W/m·K* conductivity and electrical non-conductivity, it helps tame temperatures across VRAM, VRM, and controller hot spots.
Packaging advantage – 50 g jar: a substantial supply for frequent benches and fleet maintenance; easy to decant working amounts while keeping the main jar sealed to preserve texture over longer service cycles.
The material’s soft, lightly tacky body stays where you place it yet spreads smoothly to level mixed component heights. Amateur users can achieve clean, uniform interfaces by applying a thin film, building to ~1–2 mm total thickness, and confirming a gentle imprint on reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.
Packet includes:
• 1 × 50 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
Where paste can’t reach, our putties bridge.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Built for thin form factor cooling in laptops and compact devices: fills micro gaps and maintains shape under clamp pressure to stabilize contact over GDDR6 VRAMs, VRM stages and controller chips.
• Packaging advantage – 50 g jar: ideal mid bulk capacity for small shops and power users; decant small portions for microscope work and keep reserves sealed to maintain consistency.
• Soft, lightly tacky texture for easy placement and adjustment; smooths cleanly to avoid spillover in dense areas and keeps neighboring components visible.
• Performs best at ~1–2 mm total thickness, equalizing contact across mixed heights when stock pads are undersized or uneven.
• non conductive formulation with 12.8 W/m·K* conductivity and broad operating stability—suitable for extended gaming and heavy workloads.
• UPSIREN U6 PRO is compatible with gaming laptops including Acer Nitro, ASUS ROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, and other compact thin heat sink platforms.