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When gaps hit 2–4mm, this is the bridge.
UPSIREN U6 PRO 20g is built for devices that push serious heat through very compact cooling systems. It forms a conformable, cohesive bridge between components and thin heat sinks—common in gaming laptops and slim console revisions—delivering efficient heat transfer where soft pads can miss contact. With 12.8 W/m·K* thermal conductivity and electrical non-conductivity, it focuses on the components most likely to throttle: GDDR6 VRAMs, power stages, and display/IO controllers.
Packaging advantage – 20 g jar: generous capacity for full system refreshes and small fleets while remaining easy to handle and decant; reseals cleanly between sessions to preserve texture and cleanliness.
The compound is soft and just sticky enough to stay where you place it, yet it spreads smoothly to even out height differences. Even first time users can achieve neat, uniform layers: apply a thin film, build to ~1–2 mm total thickness, and check for a light imprint on reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.
Packet includes:
• 1 × 20 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
Where paste can’t reach, our putties bridge.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Optimized for thin form factor cooling: spreads into micro gaps and maintains shape under clamp force to enhance contact over GDDR6 VRAMs, VRM stages and hot controller chips.
• Packaging advantage – 20 g jar: balanced quantity for repeat benches or multiple devices; easy to decant small portions for microscope work while keeping the main jar sealed between jobs.
• Soft, lightly tacky consistency that is easy to place and adjust; adheres gently during assembly but smooths cleanly to avoid spillover on dense boards.
• Delivers best results around 1–2 mm total thickness, stabilizing contact across mixed height components when stock pads are short, stiff, or inconsistent.
• non conductive with 12.8 W/m·K* conductivity and wide operating stability—ready for extended gaming sessions and rapid thermal cycling.
• UPSIREN U6 PRO is compatible with gaming laptops including Acer Nitro, ASUS ROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, plus other compact systems using thin heat sinks.