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The 1–2mm laptop fix that stays put.
UPSIREN U6 PRO 10g is engineered for devices that drive high power through very compact cooling hardware. It forms a conformable bridge between components and thin heat sinks, delivering dependable heat transfer where traditional soft pads struggle—common in modern gaming laptops and slim console revisions. With 12.8 W/m·K* thermal conductivity, it focuses on notorious hot spots such as GDDR6 VRAMs, power stages, and controller ASICs, while remaining electrically non conductive.
Packaging advantage – 10 g jar: a compact, resealable size that travels well in a toolkit, keeps benches tidy, and minimizes leftover material while still covering several memory/VRM zones across a typical laptop or compact board.
The texture is soft and just sticky enough to stay where you place it, yet it spreads smoothly to even out small height differences. Even amateur users can achieve neat, uniform layers: apply a thin film, build to ~1–2 mm total thickness, and confirm a gentle imprint after reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.
Packet includes:
• 1 × 10 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
Stop pampering your PC—start cooling it.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Purpose built for thin form factor cooling: wicks into micro gaps and holds shape under clamp pressure, helping low profile heat sinks move heat away from GDDR6 VRAMs, VRM stages and controller chips without relying on a perfect pad thickness.
• Packaging advantage – 10 g jar: pocketable supply for single devices or short runs; reseals cleanly between steps and reduces waste while still servicing multiple components on a laptop mainboard.
• Soft, lightly tacky consistency that is easy to place and adjust; adheres gently so the layer doesn’t skid during assembly, yet is smooth enough to feather edges and avoid spillover on dense boards.
• Ideal thickness around 1–2 mm provides a stable interface across mixed component heights, a practical fix when stock pads are slightly short, stiff, or leave corners uncovered.
• Electrically non conductive with 12.8 W/m·K* thermal conductivity and broad operating stability—suited to extended gaming sessions and productivity loads with frequent temperature swings.
• UPSIREN U6 PRO is compatible with gaming laptops including Acer Nitro, ASUS ROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, as well as other compact devices using thin heat sinks.