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Bulk confidence for compact systems.
UPSIREN U6 PRO 100g is a high capacity jar for labs, refurbishers and power users who service compact cooling solutions at scale. It delivers a conformable, cohesive heat path between components and thin heat sinks—exactly what modern gaming laptops and space constrained systems demand. With 12.8 W/m·K* conductivity and electrical non-conductivity, it targets heat dense areas like GDDR6 VRAMs and power stages to stabilize temperatures under sustained load.
Packaging advantage – 100 g jar: bulk value without compromising handling; decant small portions for microscope work, keep the main jar sealed to preserve texture, and reduce reorders on long projects.
The compound is soft and just sticky enough to stay put, yet smooth enough to spread evenly and level out minor height differences. Even amateur users can achieve clean, uniform interfaces by applying a thin film and building to ~1–2 mm total thickness before reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.
Packet includes:
• 1 × 100 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
Cosmetics smooth skin. We smooth thermal paths.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Designed for thin form factor cooling: conforms to micro gaps and resists slump to enhance contact over GDDR6 VRAMs, VRM stages and other hot controllers in compact layouts.
• Packaging advantage – 100 g jar: high capacity supply for labs and refurbishers; decant working amounts to maintain cleanliness and consistency across long, multi device projects.
• Soft, lightly tacky body that stays put during assembly yet feathers cleanly; enables tidy edges and reliable reassembly on dense boards.
• Ideal performance at ~1–2 mm total thickness, evening out mixed heights where standard pads are short, stiff, or inconsistent.
• non conductive with 12.8 W/m·K* thermal conductivity and wide operating stability, supporting frequent thermal cycling in portable and compact systems.
• UPSIREN U6 PRO is compatible with gaming laptops including Acer Nitro, ASUS ROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, along with other thin heat sink platforms.