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Peak heat flux—handle with care, win on temps.
Liquid Metal by CSGR is a premium thermal interface for users who want the highest possible heat transfer in compact modern systems. With thermal conductivity of 79 W/m·K*, it is engineered for direct die CPU and GPU applications, high density VRM hotspots, and other areas where conventional pastes cannot remove heat fast enough. The formulation wets copper and nickel plated cold plates efficiently to minimize thermal resistance, helping unlock headroom for quiet profiles or extreme performance.
Because it is electrically conductive, careful application is essential. Frame the component with K5-PRO® non conductive thermal putty to create a neat perimeter, limiting any chance of liquid metal creeping to neighboring SMDs while also filling peripheral gaps. Avoid aluminum surfaces and always use small, metered amounts on clean, polished contact zones.
Packet includes:
• 1 × 1 g applicator tube of Liquid Metal by CSGR
• 1 × 1.6 mm plastic applicator tip
• 1 × fine needle tip for precision dosing
Thin line, thick performance.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• 79 W/m·K* thermal conductivity drives exceptional heat transfer from dies and hotspots to copper/nickel coolers, enabling lower core and VRAM temperatures at the same acoustic profile or quieter fans at the same load.
• Compatible with K5-PRO® thermal putty: build a low mess, non conductive “wall” around the target area to help prevent migration and to fill any surrounding gaps or height variations for a controlled, professional finish.
• Precision, low-pressure application using the included plastic and needle tips allows drop by drop placement under magnification for desktops, gaming laptops, consoles, and small form factor systems.
• Optimized wetting on copper and nickel plated contacts forms an ultra thin, continuous interface layer that reduces thermal resistance where standard pastes struggle.
• Clear usage guidance for safe results: apply sparingly on cleaned, degreased surfaces; avoid aluminum heat sinks; insulate nearby SMDs; verify seating pressure before power up.
• Ideal for top tier scenarios such as overclocked desktops, high power GPUs, dense VRM stages, and compact water cooling blocks where maximizing heat flux matters.