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Thin bond line, thick performance.
KRYO33 3g is a high performance thermal paste formulated to maximize heat transfer while remaining electrically non conductive. Its matrix is made entirely of solid thermally conductive particles at the minimum practical size, without a fluid carrier. Under pressure it behaves like a smooth cream, forming an exceptionally thin bond line that wets microscopic surface imperfections—this is how it reaches the maximum thermal conductivity achievable for a non electrically conductive paste.
This solid particle only design also makes KRYO33 the ideal companion to our thermal putties in high performance laptops and desktops: apply KRYO33 on the CPU/GPU die and use a putty such as K5-PRO on VRAM/VRM zones to restore end to end, optimized contact across mixed interfaces in the same system.
The 3 g applicator tube is sized for clean, controlled repastes on laptops and desktops. It dispenses precise dots or lines, levels evenly under normal mounting pressure, and reaches full performance immediately—no curing needed. Store sealed, away from frost and dust, in a cool, dry place.
Packet includes:
• 1 × 3 g applicator tube of KRYO33 thermal paste
Made to touch chips, not cheeks.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Solid particle only formulation: composed exclusively of thermally conductive solids at minimal size, creating a very thin, uniform bond line that maximizes heat flow for a non electrically conductive paste.
• High transfer capability: >13 W/m·K* thermal conductivity with ultralow thermal resistance (<0.004 K/W) delivers strong temperature drops under sustained CPU/GPU loads and rapid transients.
• Zero electrical conductivity and metal free composition make it safe around dense SMD layouts and compatible with aluminum and copper heat sinks; spreads evenly under standard clamp force.
• Immediate results: no curing time required; stable through extreme operating ranges (approximately −90 °C to +270 °C) to support gaming, rendering and workstation duty cycles over the long term.
• Perfect pairing with thermal putties: use KRYO33 on the main die and a putty such as K5-PRO on pad replacement areas (VRAM/VRM) to minimize standoff and fill larger tolerances for a complete thermal service.
• KRYO33 is compatible with AMD Ryzen and Intel Core desktop and laptop CPUs, and with GPU dies across NVIDIA GeForce and AMD Radeon families in performance PCs and gaming laptops.