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Workshop jar—consistent putty, week after week.
K5 PRO 110g is a workshop sized jar of our viscous, non conductive thermal putty created to make pad replacement straightforward for everyone. Trusted since 2013 and widely adopted across repair communities, it is recognized as one of the most used thermal putties worldwide for several years thanks to its consistent, forgiving application and reliable performance.
This 110 g jar balances capacity and handling for repeated maintenance cycles. It supports fleet work without jumping to full bulk supply, decants easily into small cups for microscope jobs, and keeps the main jar sealed between sessions to preserve texture and cleanliness. It’s a practical size for small shops that service devices week after week.
As a daily solution, K5-PRO covers the vast majority of pad replacement scenarios on laptops, desktops, and consoles. It spreads smoothly, holds its shape, and maintains cohesive contact between components and heat sinks—even across uneven surfaces and around height variations—so you can restore reliable heat transfer without hunting for exact pad thicknesses.
Beyond standard repairs, K5-PRO also solves thermal transfer challenges in custom or compact builds. Use it to create a controllable heat bridge from hot components to metal housings or frames in devices such as home routers, access points, LED light bars/panels, DVRs/NVRs, and single board computer enclosures. Users around the world have reported lower memory temperatures, quieter fans, and improved stability after replacing aged or poorly sized pads, with consistent gains when dealing with mixed gap heights and irregular interfaces. Store sealed, away from frost and dust; keep in a cool, dry place to maintain long term stability.
Packet includes:
• 1 × 110 g jar of K5-PRO thermal putty
• 1 × wooden applicator
• 1 × instruction leaflet
Beauty creams moisturize. Our TIMs mobilize heat.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Establishes a stable, shapeable interface that equalizes irregular gaps so heat sinks seat properly and heat transfers consistently across VRAM/VRM arrays and frame edge contact points.
• Packaging advantage – 110 g jar: ample capacity for ongoing service while remaining easy to decant into small cups for microscope work; preserves freshness by keeping the main jar sealed between jobs.
• Fills up to 3 mm (≈1 mm optimal) and resists sag/pump out, especially useful where mixed component heights and standoffs complicate pad selection.
• >5.3 W/m·K* thermal conductivity within a −90 °C to 250 °C operating window; electrically non conductive and serviceable during future tear downs.
• Suited to DIY heat bridging into metal housings in routers, LED assemblies, DVRs/NVRs, and compact embedded devices with limited airflow.
• K5-PRO is compatible with Apple iMac, Acer Nitro, ASUS ROG, MSI laptops, PlayStation 4, Nintendo Switch, Xbox One, and NVIDIA GeForce GTX 10series boards.