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Fleet paste that outlasts maintenance windows.
K4 PRO 500g is a high capacity jar of our low viscosity, silicone based thermal paste designed for installations that are serviced once and then left to run reliably. It forms a thin, uniform, wetting film that maintains contact across microscopic gaps between heat sink and component, supporting consistent heat flow over long operating lifetimes. With thermal conductivity >4.6 W/m·K*, electrical non conductivity and operating stability up to 220 °C, it is well suited to production lines, refurbishers and labs building business desktops, terminals, kiosks, network appliances and embedded systems that will not be routinely reopened.
The 500 g jar offers economical coverage for multi device projects and ongoing maintenance across fleets. Decant small portions into cups for precise work while keeping the main jar sealed to preserve texture and cleanliness over long service cycles.
K4-PRO is equally at home in industrial and fanless designs where heat sink cleaning is infrequent or impractical. When a device also uses soft pads around memory or power stages, pair K4-PRO on the CPU/GPU die with K5-PRO on surrounding components to restore end to end contact. K4-PRO is compatible with Apple iMac and Sony PlayStation 2, along with other devices that specify a standard thermal paste interface on the main die.
Packet includes:
• 1 × 500 g jar of K4-PRO silicone thermal paste
Skincare belongs in bathrooms. Heat care belongs in machines.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Built for longevity in production and fleet service: silicone formulation keeps a stable, wetting film that resists dry out, preserving heat sink contact through years of duty cycles and temperature swings.
• low viscosity spread that fills micro gaps and machining marks to maximize real contact area at low clamp force, reducing hotspots without repeated reseating.
• Proven thermal capability: conductivity >4.6 W/m·K* with electrical non conductivity and temperature stability to 220 °C, appropriate for sealed, fanless and industrial enclosures.
• Ideal when routine reopening isn’t planned—business PCs, terminals, kiosks, embedded controllers and network appliances—where “apply and forget” performance is critical.
• Pairs effectively with K5-PRO on the same device: K4-PRO covers the die interface while K5-PRO handles VRAM/VRM gaps, a combination used successfully on iMac video boards and PS2era consoles.
• Bulk 500 g jar supports labs and production benches: decant working amounts to maintain cleanliness and consistent texture across long projects and multiunit batches.