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Apply and forget paste for machines, not faces.
K4 PRO 10g is a low viscosity, silicone based thermal paste engineered for longevity. It spreads into a thin, uniform film that wets machining marks and invisible surface gaps, maintaining reliable contact between the component and heat sink for years of service. With thermal conductivity >4.6 W/m·K*, electrically non conductive formulation, and temperature stability up to 220 °C, it is a solid choice for enterprise desktops, thin clients, point of sale terminals, signage players and embedded controllers that are installed once and expected to run continuously.
The 10 g applicator tube format supports clean, controlled placement—express a small bead or narrow line and let the heat sink pressure level it evenly. This size travels easily in a toolkit, suits single system deployments, and minimizes leftover material on the shelf.
K4-PRO also suits industrial and production electronics not designed for frequent heat sink cleaning, as well as sealed or fanless systems that will rarely—if ever—be opened. For complete thermal service on devices that also use soft pads, K4-PRO works well together with K5-PRO on memory and power components; users have reported optimal results on systems such as iMac video boards and PlayStation 2–era consoles. K4-PRO is compatible with Apple iMac and Sony PlayStation 2, along with other devices that use standard CPU/GPU thermal paste on the main die.