Image 1 of 10
Image 2 of 10
Image 3 of 10
Image 4 of 10
Image 5 of 10
Image 6 of 10
Image 7 of 10
Image 8 of 10
Image 9 of 10
Image 10 of 10
Bulk—not bulky. Decant, apply, repeat.
K5 PRO 400g is a high capacity jar of our viscous, non conductive thermal putty—popular worldwide since 2013 for accessible, repeatable pad replacement. It spreads evenly, holds its shape, and maintains cohesive contact over uneven surfaces, restoring consistent thermal transfer without stacking pads or hunting for exact pad thicknesses.
This bulk 400 g jar is built for volume. Decant small portions into cups for microscope work, keep the main jar sealed to preserve freshness, and reduce reorders with a lower cost per gram on sustained projects. It suits refurbishers, labs, and production benches that service device families week after week.
As a daily solution, K5-PRO covers the vast majority of pad replacement scenarios on laptops, desktops, and consoles. It spreads smoothly, holds its shape, and maintains cohesive contact between components and heat sinks—even across uneven surfaces and around height variations—so you can restore reliable heat transfer without hunting for exact pad thicknesses.
Beyond standard repairs, K5-PRO also solves thermal transfer challenges in custom or compact builds. Use it to create a controllable heat bridge from hot components to metal housings or frames in devices such as home routers, access points, LED light bars/panels, DVRs/NVRs, and single board computer enclosures. Users around the world have reported lower memory temperatures, quieter fans, and improved stability after replacing aged or poorly sized pads, with consistent gains when dealing with mixed gap heights and irregular interfaces. Store sealed, away from frost and dust; keep in a cool, dry place to maintain long term stability.
Packet includes:
• 1 × 400 g jar of K5-PRO thermal putty
• 1 × instruction leaflet
Skincare belongs in bathrooms. Heat care belongs in machines.
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
• Creates a stable, shapeable interface that replaces soft pads and equalizes uneven gaps so heat sinks seat correctly for dependable heat transfer across memory and power stages.
• Packaging advantage – 400 g jar: optimized for high volume benches; decant working amounts to minimize exposure, preserve texture over long projects, and lower cost per application.
• Fills up to 3 mm (≈1 mm optimal) and resists sag/pump out across mixed height arrays, screw posts, and frame edges where stock pads struggle to maintain contact.
• >5.3 W/m·K* thermal conductivity with an operating range from −90 °C to 250 °C; electrically non conductive and serviceable during future tear downs.
• Effective for DIY and professional heat bridging to metal housings in routers, LED arrays, DVRs/NVRs, and compact embedded systems with limited airflow.
• K5-PRO is compatible with Apple iMac, Acer Nitro, ASUS ROG, MSI laptops, PlayStation 4, Nintendo Switch, Xbox One, and NVIDIA GeForce GTX 10series boards.